Silicone LED encapsulants

Introduction：

          Silicone LED encapsulants ,professionally developed for  SMD LED and silica gel integrated high power LED ,such as 1210, 3528, 5050 etc., which is the  A and B  two-component  rubber material  by curing and heating organic silicone.After curing , It has the features of  good elasticity ，high and low temperature resistance,can be used for a long time in   - 50 ℃ ~ 200 ℃ .The  technical indicators of this product have passed by the seven days '  intensifying test which  under the testing condition of   300 ℃   The features after testing： no cracks, no hardening ，High light transmittance, high refractive index，good thermal stability ，low stress ，no yellowing ，resistance to aging  ，low moisture absorption ,etc.

Recommended process

1,To get better effect ,Suggest using different matching according to the different encapsulation process .For productions of  SMD LED (1210, 3528, 5050, etc.) and  Integrated high power LED, the  ratio is A: B = 1:1
2,Mixing the A and B encapsulants for  5 ~ 10 minutes ，and then heated to a temperature of 45 ℃, vacuum defoamation for about 15 minutes
3,Keeping 45 ℃ When dispensing the encapsulants  ，At the same time  preheat the  holder  in  150 ℃ for  more than 60 minutes for dehumidification. Seal  as soon as possible before the holder  absorbs the  moisture （within 3 ~ 4 hours after the dehumidification ）.After sealing , please check if there are  abubbles  in  the encapsulants  in the holder ，If  any， get rid of the bubble 
4,Heating and curing  ，the stander cure condition : 80℃～100℃ baking for 60 minutes  ，and then  increase the temperature to 150 ℃, baking for 2 ~3 hours, extend cure time helps to improve the bonding performance

The property after curing

1,Colorless transparent body .Excellent adhesion and sealing effect to the PPA and metal material.

2,Having a certain hardness .Suitable for packaging of plane without lens integrated high power LED.

3,Excellent for electrical insulation properties and resistance to high and low temperature performance.
4,After the curing and  reflow soldering  in 270 ℃ high temperature It still has excellent adhesion and sealing effect to the PPA and metal material.

Using notice:
1,The substrate surface should be clean and dry.  Remove the moisture on the surface of the substrate by heating it .Clean the substrate surface with an appropriate solvent. Don't  use the dissolved or corrosion solvent  to the substrate surface  for cleaning . Don't use the  residual solvents. Recommend that operating and  production should be  in the dry clean environment.
2,AB encapsulants must be mixed and stir evenly , or otherwise it will influence  the curing property.

3.,To ensure the operability of encapsulants, shouled use it  within 4 to 5 hours  after A and B mixture stirring , to get  the best effect  need complete the using within  four hours .

Notice :

     Some materials, chemicals, curing agent and plasticizer can inhibit the curing of the gel material. The most noteworthy material include:
1,Organic tin and other metal compounds; Some of the flux residues.
2,Sulfur, polysulfide, polysulfone or other items that  containing sulfur content .
3,Amine, polyurethane rubber or ammonia containing items; The phosphorus or phosphorus containing  item.

Storage and Transportation
1,Colloid A and B components are to be kept sealed, avoid contact with moisture in the air, and be careful of leakage during the transit.

2,Such products are non-dangerous goods,can transport according to general chemical transportation.

3,A cool and dry place for storage, storage period is 1 year (25 ℃).

Special statement:

       If in doubt of a material or a base material will inhibit curing or not , suggest to do a compatibility experiments to test the suitability of a particular application. If there exists the  not cured encapsulating material  between  the interface of the base and  curing rubber ,that means it is incompatible, inhibits the curing.